用于电子封装元件或MEMS加固的耦合减振器的实验研究

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298739

Y. Ping

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引用次数: 1

摘要

针对电子封装元件或MEMS振动冲击安全中的抗剧烈冲击和减振需求，采用巧妙的策略，设计了一种将空气、油、橡胶和金属弹性元件耦合在一起的多介质微耦合减振器。对耦合减振器的冲击力学特性进行了多参数耦合试验研究。结果表明，该键模机具有良好的抗猛烈冲击性能和较强的非线性动态特性。通过改变减振器的参数，研究了减振器的可控设计能力。研究结果为今后电子封装元件或MEMS振动冲击安全中抗剧烈冲击的工程设计研究奠定了实验基础。

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Experimental research on a coupling shock absorber for reinforcement of electronic-packaging component or MEMS

A multi-medium micro-coupling shock absorber is designed through coupling the air, oil, rubber and metallic elastic component by ingenious tactics for the demands of resisting violent impact and attenuating vibration in vibration-impact-safety of electronic-packaging components or MEMS. Multi-parameter coupling experimental study of the impact mechanical characteristics of the coupling shock absorber is developed. The results show that the key-model machine has a good performance for resisting violent impact and strongly nonlinear dynamic characteristics. The controllable design-capability of the shock absorber is studied by changing of the parameters. So the research results lay an experimental base for future research of engineering design for resisting violent impact in vibration-impact-safety of electronic-packaging components or MEMS.

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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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