热/电条件下铝互连线机械应力的原位观察

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2009-07-06 DOI:10.1109/IPFA.2009.5232722

Zhiguo Li, Yuehua Wu, H. Fu, Chunsheng Guo, Yuan Ji, Zhimin Liu

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引用次数: 0

摘要

用同步辐射x射线衍射原位观察电迁移和热效应下铝互连中的应力。通过改变W(自热结构)的电流密度来控制测试温度。在电流密度为3×105A/cm2至4×106A/cm2的情况下，研究了电磁诱发应力。所得结论与仿真结果吻合较好。

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In-suit observations of mechanical stress in Al interconnect line under thermal/electrical conditions

In-situ observation of stress in Al interconnects under electromigration and thermal effect by using the synchrotron radiation x-ray diffraction. The test temperature was controlled by changing the current density of W (self-heating structure). The EM-induced stress was also investigated with current densities from 3×105A/cm2 to 4×106A/cm2. The conclusion agreed well with the simulation results.

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2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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