T. Uemura, Byungjin Chung, Shin-Young Chung, Seungbae Lee, Yuchul Hwang, S. Pae
{"title":"设计和工艺对4nm块体finfet SRAM α诱导SER的影响","authors":"T. Uemura, Byungjin Chung, Shin-Young Chung, Seungbae Lee, Yuchul Hwang, S. Pae","doi":"10.1109/IRPS48203.2023.10117908","DOIUrl":null,"url":null,"abstract":"This paper evaluates alpha-induced soft error rate $\\boldsymbol{(\\alpha \\text{SER})}$ by alpha irradiation test in four different SRAMs and simulation. The test result shows the impact of three factors on $\\boldsymbol{\\alpha \\text{SER}}$: process technology, the number of fins, and fin-pitch. The process technology advancing from 7 nm to 4 nm increases the $\\boldsymbol{\\alpha \\text{SER}}$ by 33%, the #fin change (2-fin to 1-fin) decreases the $\\boldsymbol{\\alpha \\text{SER}}$ by 54%, and the fin-pitch shrinking increases the $\\boldsymbol{\\alpha \\text{SER}}$ by 17%. The simulation results show that the process variation does not contribute to the $\\boldsymbol{\\alpha \\text{SER}}$. The BEOL thickness change can increase the $\\boldsymbol{\\alpha \\text{SER}}$ by 1.24X. This paper also discusses the $\\boldsymbol{\\alpha \\text{SER}}$ trend in SRAM from 130 nm to 4 nm technologies. Overall, the study aims to investigate the impact of process technology and design parameters on $\\boldsymbol{\\alpha \\text{SER}}$ in SRAMs.","PeriodicalId":159030,"journal":{"name":"2023 IEEE International Reliability Physics Symposium (IRPS)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Impact of Design and Process on Alpha-Induced SER in 4 nm Bulk-FinFET SRAM\",\"authors\":\"T. Uemura, Byungjin Chung, Shin-Young Chung, Seungbae Lee, Yuchul Hwang, S. Pae\",\"doi\":\"10.1109/IRPS48203.2023.10117908\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper evaluates alpha-induced soft error rate $\\\\boldsymbol{(\\\\alpha \\\\text{SER})}$ by alpha irradiation test in four different SRAMs and simulation. The test result shows the impact of three factors on $\\\\boldsymbol{\\\\alpha \\\\text{SER}}$: process technology, the number of fins, and fin-pitch. The process technology advancing from 7 nm to 4 nm increases the $\\\\boldsymbol{\\\\alpha \\\\text{SER}}$ by 33%, the #fin change (2-fin to 1-fin) decreases the $\\\\boldsymbol{\\\\alpha \\\\text{SER}}$ by 54%, and the fin-pitch shrinking increases the $\\\\boldsymbol{\\\\alpha \\\\text{SER}}$ by 17%. The simulation results show that the process variation does not contribute to the $\\\\boldsymbol{\\\\alpha \\\\text{SER}}$. The BEOL thickness change can increase the $\\\\boldsymbol{\\\\alpha \\\\text{SER}}$ by 1.24X. This paper also discusses the $\\\\boldsymbol{\\\\alpha \\\\text{SER}}$ trend in SRAM from 130 nm to 4 nm technologies. Overall, the study aims to investigate the impact of process technology and design parameters on $\\\\boldsymbol{\\\\alpha \\\\text{SER}}$ in SRAMs.\",\"PeriodicalId\":159030,\"journal\":{\"name\":\"2023 IEEE International Reliability Physics Symposium (IRPS)\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE International Reliability Physics Symposium (IRPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS48203.2023.10117908\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS48203.2023.10117908","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Impact of Design and Process on Alpha-Induced SER in 4 nm Bulk-FinFET SRAM
This paper evaluates alpha-induced soft error rate $\boldsymbol{(\alpha \text{SER})}$ by alpha irradiation test in four different SRAMs and simulation. The test result shows the impact of three factors on $\boldsymbol{\alpha \text{SER}}$: process technology, the number of fins, and fin-pitch. The process technology advancing from 7 nm to 4 nm increases the $\boldsymbol{\alpha \text{SER}}$ by 33%, the #fin change (2-fin to 1-fin) decreases the $\boldsymbol{\alpha \text{SER}}$ by 54%, and the fin-pitch shrinking increases the $\boldsymbol{\alpha \text{SER}}$ by 17%. The simulation results show that the process variation does not contribute to the $\boldsymbol{\alpha \text{SER}}$. The BEOL thickness change can increase the $\boldsymbol{\alpha \text{SER}}$ by 1.24X. This paper also discusses the $\boldsymbol{\alpha \text{SER}}$ trend in SRAM from 130 nm to 4 nm technologies. Overall, the study aims to investigate the impact of process technology and design parameters on $\boldsymbol{\alpha \text{SER}}$ in SRAMs.