高速VLSI电路上先进互连的性能表征

C. Bermond, B. Fléchet, G. Le Carval, F. Charlet, Y. Morand, G. Angénieux, R. Salik
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引用次数: 3

摘要

给出了一个完整的程序来测量和模拟或预测单个或耦合长损耗集成电路互连的高速性能。从测量中提取传播常数、特性阻抗和R、L、C、G矩阵参数,并与EM建模得到的值进行比较。接下来,研究了高速信号的延迟、失真或串扰方面的性能:显示了低k介电介质和Al-Cu或Cu-CMP工艺的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Performance Characterization of Advanced Interconnects on High Speed VLSI Circuits
A full procedure to measure and simulate or predict high speed performance of single or coupled long-lossy IC interconnects is presented. Propagation constant, characteristic impedance and R, L, C, G matrix parameters are extracted from measurements and compared to values obtained by EM modeling. Next, performance in terms of delays, distortion or crosstalk of high speed signals are studied : impacts of low-K dielectrics and Al-Cu or Cu-CMP processes are shown.
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