薄膜用莫来石陶瓷衬底

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122170

T. Kurihara, M. Horiuchi, Y. Takéuchi, Shigemi Wakabayashi

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引用次数: 6

摘要

探讨了莫来石陶瓷薄膜材料的优点。采用均匀粉末，在不添加烧结助剂的情况下，提供了由细小莫来石颗粒组成的致密莫来石基体。所获得的性能优于M. Horiuchi等人(1988)提出的莫来石和用于封装和衬底的传统氧化铝:低介电常数

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Mullite ceramic substrate for thin-film application

The advantages of mullite ceramic for thin-film application are examined. Using homogeneous powder, a dense mullite substrate consisting of fine mullite grains was provided without the addition of a sintering aid. The properties obtained are superior to those of the mullite presented by M. Horiuchi et al. (1988) and a conventional alumina for application to packages and substrates: low dielectric constant

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来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

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