半导体器件芯片级热不均匀性评价研究

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Pub Date : 2009-07-06 DOI:10.1109/IPFA.2009.5232587

Zhang Guangchen, F. Shiwei, Zhang Yuezong, Su Rong, Xie Xuesong, Ge Chenning

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引用次数: 1

摘要

提出了一种利用电瞬态热响应测试来评价半导体器件芯片级热非均匀性的新方法。通过器件的热响应曲线可以无损地判断集成芯片的热不均匀程度。

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Study on the chip-level thermal non-uniformity evaluation of semiconductor devices

A novel method is proposed to evaluate the chip-level thermal non-uniformity of semiconductor devices by electrical transient thermal response testing. It is found that the degree of integrated chip thermal non-uniformity could be determined non-destructively by the device heating response curves.

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2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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