{"title":"2d材料mosfet的接触:最新进展和突出挑战","authors":"S. Koester","doi":"10.1109/EDTM55494.2023.10103009","DOIUrl":null,"url":null,"abstract":"A review of advances in contact technology for 2D material MOSFETs is provided. Phase-engineered contacts to transition metal dichalcogenides (TMDCs) are reviewed, along with recent progress on semimetallic contacts to TMDCs. Finally, the outstanding manufacturing challenges are discussed.","PeriodicalId":418413,"journal":{"name":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","volume":"190 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Contacts for 2D-Material MOSFETs: Recent Advances and Outstanding Challenges\",\"authors\":\"S. Koester\",\"doi\":\"10.1109/EDTM55494.2023.10103009\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A review of advances in contact technology for 2D material MOSFETs is provided. Phase-engineered contacts to transition metal dichalcogenides (TMDCs) are reviewed, along with recent progress on semimetallic contacts to TMDCs. Finally, the outstanding manufacturing challenges are discussed.\",\"PeriodicalId\":418413,\"journal\":{\"name\":\"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)\",\"volume\":\"190 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-03-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDTM55494.2023.10103009\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTM55494.2023.10103009","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Contacts for 2D-Material MOSFETs: Recent Advances and Outstanding Challenges
A review of advances in contact technology for 2D material MOSFETs is provided. Phase-engineered contacts to transition metal dichalcogenides (TMDCs) are reviewed, along with recent progress on semimetallic contacts to TMDCs. Finally, the outstanding manufacturing challenges are discussed.
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