低电感去耦电容器的电磁分析

Proceedings of IEEE Electrical Performance of Electronic Packaging Pub Date : 1993-10-20 DOI:10.1109/EPEP.1993.394585

B. Beker, G. Cokkinides, A. Templeton

{"title":"低电感去耦电容器的电磁分析","authors":"B. Beker, G. Cokkinides, A. Templeton","doi":"10.1109/EPEP.1993.394585","DOIUrl":null,"url":null,"abstract":"Computer aided design (CAD) tools, based on electromagnetic (EM) models, for the analysis and design of low inductance decoupling capacitors are discussed. The theoretical background for EM models employed in the computer analysis is reviewed. Numerical results for a practical device are shown.<<ETX>>","PeriodicalId":338671,"journal":{"name":"Proceedings of IEEE Electrical Performance of Electronic Packaging","volume":"35 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"EM analysis of low inductance decoupling capacitors\",\"authors\":\"B. Beker, G. Cokkinides, A. Templeton\",\"doi\":\"10.1109/EPEP.1993.394585\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Computer aided design (CAD) tools, based on electromagnetic (EM) models, for the analysis and design of low inductance decoupling capacitors are discussed. The theoretical background for EM models employed in the computer analysis is reviewed. Numerical results for a practical device are shown.<<ETX>>\",\"PeriodicalId\":338671,\"journal\":{\"name\":\"Proceedings of IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"35 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-10-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1993.394585\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1993.394585","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

讨论了基于电磁模型的计算机辅助设计(CAD)工具，用于分析和设计低电感去耦电容器。综述了电磁模型用于计算机分析的理论背景。给出了实际装置的数值结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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EM analysis of low inductance decoupling capacitors

Computer aided design (CAD) tools, based on electromagnetic (EM) models, for the analysis and design of low inductance decoupling capacitors are discussed. The theoretical background for EM models employed in the computer analysis is reviewed. Numerical results for a practical device are shown.<>

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Proceedings of IEEE Electrical Performance of Electronic Packaging

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