电子封装虚拟实验室开发进展

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Pub Date : 2000-05-21 DOI:10.1109/ECTC.2000.853342

P. Gordon, P. Bojta, L. Hertel, I. Kallai, I. Lepsenyi, L. Varnai, Z. Illyefalvi-Fitez

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引用次数: 6

摘要

信息技术的发展为电子封装教育开辟了新的前景，为21世纪的需要培养工程师。电子技术系多年来一直致力于提高这方面的教育水平。它于1999年获得了IEEE/NSF的资助，创建了虚拟实验室，这是一个使用最新的高质量网络技术的教育支持解决方案。本文对一年来的实际开发成果进行了总结。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Progress in electronics packaging virtual laboratory development

The development of information technology has opened new perspectives in electronics packaging education to prepare engineers for the needs of the 21/sup st/ century. The Department of Electronics Technology has been working on the improvement of the education in this respect for many years. It has obtained an IEEE/NSF grant in 1999 to create the Virtual Laboratory, a solution of the educational support with the newest and high-quality Web-technology. This paper gives a summary of the results of the one-year long practical development.

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来源期刊

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

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