sn - ag基无铅焊料FBGA组件热循环疲劳模型的开发

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI:10.1109/IEMT.2008.5507875

F. Che, J. Luan, D. Yap, K. Goh, X. Baraton

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引用次数: 9

摘要

随着对无铅焊料的要求不断提高，人们希望了解不同的焊料合金对微电子组件可靠性的影响。研究人员已经建立了一些Sn-Ag-Cu (SAC)焊料的疲劳寿命模型。镍掺杂无铅焊料由于其良好的跌落性能，在电子封装中得到越来越多的应用。目前，对于掺杂Ni的SAC焊料，缺乏疲劳寿命模型。本文对5种采用Sn-Ag-Cu-Ni (SACN)无铅焊料的FBGA (Fine pitch BGA)组件进行了热循环试验和有限元模拟。结合实验和仿真结果，建立了SACN焊料FBGA组件的热疲劳寿命预测模型。预测寿命与实验寿命具有良好的相关性。此外，基于有限元仿真结果和建立的寿命模型，研究了几何形状和加载条件对焊点预测寿命的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder

With the increasing requirement for lead-free solders, it is desired to know how different solder alloys affect on reliability of microelectronic assembly. Some fatigue life models for Sn-Ag-Cu (SAC) solder have been developed by researchers. The Ni-dopant lead free solder is increasingly used in electronic packages due to its good drop performance. Currently, it lacks the fatigue life model for Ni doped SAC solder. In this paper, thermal cycling test and finite element simulation were conducted for 5 FBGA (Fine pitch BGA) assemblies with Sn-Ag-Cu-Ni (SACN) lead free solder. The thermal fatigue life prediction model was developed for FBGA assemblies with SACN solder by combining experimental and simulation results. The good correlation between predicted and experimental lives was achieved. In addition, the effect of geometry and loading condition on solder joint predicted life was investigated based on the finite element simulation result and the developed life model.

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2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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