基于优化锁定热成像频率的封装级缺陷定位实例研究

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2019-07-01 DOI:10.1109/IPFA47161.2019.8984886

Carlo M. Casabuena, E. J. de La Cruz

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引用次数: 1

摘要

本案例研究通过优化基于电阻的锁定热成像(LIT)频率，结合3D x射线定位缺陷和EDX(能量色散x射线)进行根本原因分析，概述了成功的封装级故障检测。通过优化锁定频率，确定了缺陷在封装上的准确位置，从而有效地确定了失效机理，准确地调查了根本原因。

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Case Study on Package Level Defect Localization through Optimized Lock-in Thermography Frequency

This case study outlines the successful package-level failure site detection by optimizing the Lock-In Thermography (LIT) frequency based on resistance, combined with 3D X-ray for locating the defect and EDX (Energy Dispersive X-ray) for root-cause analysis. By optimizing the lock-in frequency, the exact location of the defect on the package was identified, thus, leading to effective determination of failure mechanism and accurate root cause investigation.

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来源期刊

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)

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