{"title":"重掺杂平面二极管中的载流子复合","authors":"G. Possin, C. Kirkpatrick","doi":"10.1109/IEDM.1978.189420","DOIUrl":null,"url":null,"abstract":"A process is described which produces a shallow pn junction device with heavy surface doping and very high collection efficiency. Electron beam techniques were used to measure collection efficiency as a function of depth and to modulate the surface recombination velocity through an MOS capacitor fabricated on the diode. The results of these studies indicate that surface recombination is the dominant effect on carrier loss.","PeriodicalId":164556,"journal":{"name":"1978 International Electron Devices Meeting","volume":"70 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Carrier recombination in heavily doped planar diodes\",\"authors\":\"G. Possin, C. Kirkpatrick\",\"doi\":\"10.1109/IEDM.1978.189420\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A process is described which produces a shallow pn junction device with heavy surface doping and very high collection efficiency. Electron beam techniques were used to measure collection efficiency as a function of depth and to modulate the surface recombination velocity through an MOS capacitor fabricated on the diode. The results of these studies indicate that surface recombination is the dominant effect on carrier loss.\",\"PeriodicalId\":164556,\"journal\":{\"name\":\"1978 International Electron Devices Meeting\",\"volume\":\"70 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1978 International Electron Devices Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.1978.189420\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1978 International Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.1978.189420","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Carrier recombination in heavily doped planar diodes
A process is described which produces a shallow pn junction device with heavy surface doping and very high collection efficiency. Electron beam techniques were used to measure collection efficiency as a function of depth and to modulate the surface recombination velocity through an MOS capacitor fabricated on the diode. The results of these studies indicate that surface recombination is the dominant effect on carrier loss.