混合模式和射频集成电路中的衬底耦合

Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334) Pub Date : 1997-09-07 DOI:10.1109/ASIC.1997.617025

N. Verghese, D. Allstot

{"title":"混合模式和射频集成电路中的衬底耦合","authors":"N. Verghese, D. Allstot","doi":"10.1109/ASIC.1997.617025","DOIUrl":null,"url":null,"abstract":"This paper overviews substrate coupling in mixed mode and RF integrated circuits. Verification methods are reviewed with emphasis on modeling techniques for the substrate. An efficient substrate coupling simulation methodology is presented that utilizes macromodels of the circuit, substrate and package, and a design example is illustrated.","PeriodicalId":300310,"journal":{"name":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1997-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Substrate coupling in mixed-mode and RF integrated circuits\",\"authors\":\"N. Verghese, D. Allstot\",\"doi\":\"10.1109/ASIC.1997.617025\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper overviews substrate coupling in mixed mode and RF integrated circuits. Verification methods are reviewed with emphasis on modeling techniques for the substrate. An efficient substrate coupling simulation methodology is presented that utilizes macromodels of the circuit, substrate and package, and a design example is illustrated.\",\"PeriodicalId\":300310,\"journal\":{\"name\":\"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-09-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASIC.1997.617025\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASIC.1997.617025","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 9

摘要

本文综述了混合模式下衬底耦合和射频集成电路。对验证方法进行了回顾，重点介绍了基板的建模技术。提出了一种利用电路、衬底和封装宏观模型的高效衬底耦合仿真方法，并给出了设计实例。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Substrate coupling in mixed-mode and RF integrated circuits

This paper overviews substrate coupling in mixed mode and RF integrated circuits. Verification methods are reviewed with emphasis on modeling techniques for the substrate. An efficient substrate coupling simulation methodology is presented that utilizes macromodels of the circuit, substrate and package, and a design example is illustrated.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)

自引率

0.00%

发文量