混合模式和射频集成电路中的衬底耦合

Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334) Pub Date : 1997-09-07 DOI:10.1109/ASIC.1997.617025

N. Verghese, D. Allstot

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引用次数: 9

摘要

本文综述了混合模式下衬底耦合和射频集成电路。对验证方法进行了回顾，重点介绍了基板的建模技术。提出了一种利用电路、衬底和封装宏观模型的高效衬底耦合仿真方法，并给出了设计实例。

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Substrate coupling in mixed-mode and RF integrated circuits

This paper overviews substrate coupling in mixed mode and RF integrated circuits. Verification methods are reviewed with emphasis on modeling techniques for the substrate. An efficient substrate coupling simulation methodology is presented that utilizes macromodels of the circuit, substrate and package, and a design example is illustrated.

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Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)

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