制定处理器电路设计的电压容差规范

T. Zhou, J. Friedrich, W. Becker
{"title":"制定处理器电路设计的电压容差规范","authors":"T. Zhou, J. Friedrich, W. Becker","doi":"10.1109/EPEPS.2011.6100174","DOIUrl":null,"url":null,"abstract":"A well defined power supply tolerance specification is very important for designing processor circuits with sufficient performance margin. We introduce a design flow to derive the voltage tolerance specification by including power noise components due to the significant contributors, namely, voltage drop, voltage gradient, middle frequency chip package resonance noise, high frequency simultaneous switching noise (SSN), and voltage regulation module (VRM) tolerance. This method has been serving well for power tolerance specifications of multiple generations of IBM processor designs. However, the methodology needs further refinement to design the off-chip serial interfaces. As the interfaces are increasing in frequency, the voltage levels and swings are minimized to meet the performance criteria of maximizing the data transfer rate per watt.","PeriodicalId":313560,"journal":{"name":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","volume":"145 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Deriving voltage tolerance specification for processor circuit design\",\"authors\":\"T. Zhou, J. Friedrich, W. Becker\",\"doi\":\"10.1109/EPEPS.2011.6100174\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A well defined power supply tolerance specification is very important for designing processor circuits with sufficient performance margin. We introduce a design flow to derive the voltage tolerance specification by including power noise components due to the significant contributors, namely, voltage drop, voltage gradient, middle frequency chip package resonance noise, high frequency simultaneous switching noise (SSN), and voltage regulation module (VRM) tolerance. This method has been serving well for power tolerance specifications of multiple generations of IBM processor designs. However, the methodology needs further refinement to design the off-chip serial interfaces. As the interfaces are increasing in frequency, the voltage levels and swings are minimized to meet the performance criteria of maximizing the data transfer rate per watt.\",\"PeriodicalId\":313560,\"journal\":{\"name\":\"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems\",\"volume\":\"145 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-12-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2011.6100174\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2011.6100174","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

明确的电源容差规格对于设计具有足够性能裕度的处理器电路是非常重要的。我们介绍了一种设计流程,通过将电压降、电压梯度、中频芯片封装共振噪声、高频同步开关噪声(SSN)和稳压模块(VRM)容差等功率噪声分量包括在内,推导出电压容差规格。这种方法已经很好地服务于多代IBM处理器设计的功率容限规范。然而,该方法需要进一步完善,以设计片外串行接口。随着接口频率的增加,电压水平和波动被最小化,以满足最大化每瓦数据传输速率的性能标准。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Deriving voltage tolerance specification for processor circuit design
A well defined power supply tolerance specification is very important for designing processor circuits with sufficient performance margin. We introduce a design flow to derive the voltage tolerance specification by including power noise components due to the significant contributors, namely, voltage drop, voltage gradient, middle frequency chip package resonance noise, high frequency simultaneous switching noise (SSN), and voltage regulation module (VRM) tolerance. This method has been serving well for power tolerance specifications of multiple generations of IBM processor designs. However, the methodology needs further refinement to design the off-chip serial interfaces. As the interfaces are increasing in frequency, the voltage levels and swings are minimized to meet the performance criteria of maximizing the data transfer rate per watt.
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