一种16元w波段相控阵收发器芯片组,具有用于多千兆数据链路的倒装PCB集成天线

S. Shahramian, M. Holyoak, Y. Baeyens
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引用次数: 35

摘要

本文介绍了一种集成PCB天线的w波段相控阵系统的设计与实现,该系统可实现多千兆频谱高效无线通信。该芯片组采用0.18μm SiGe BiCMOS技术制造,fT/fMAX为240/270GHz,并倒装到集成天线阵列的有机PCB上。每个芯片都配备了16发送/4接收或16接收/4发送校准移相器元件,直接上行和下行转换器加上半速率锁相环。每个收发器IC在1.5V和2.5V电源下工作,在发射和接收模式下分别消耗5.5W和4.5W。发射机各极化EIRP为34dBm。在20米的距离上演示了每个极化的4.8Gb/s QPSK无线链路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 16-element W-band phased array transceiver chipset with flip-chip PCB integrated antennas for multi-gigabit data links
This paper describes the design and implementation of a W-band phased array system with integrated PCB antennas capable of multi-gigabit spectrally-efficient wireless communication. The chipset is manufactured in a 0.18μm SiGe BiCMOS technology with fT/fMAX of 240/270GHz and is flip-chipped onto an organic PCB with integrated antenna arrays. Each chip is equipped with 16-transmit/4-receive or 16-receive/4-transmit calibrated phase shifter elements, direct up- and down-converters plus a half-rate phase locked loop. Each transceiver IC operates from 1.5V and 2.5V supplies and consumes 5.5W and 4.5W in transmit and receive mode respectively. The transmitter EIRP is 34dBm in each polarization. A 4.8Gb/s QPSK wireless link in each polarization is demonstrated at a distance of 20-meters.
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