T. Watanabe, K. Srinivasan, H. Asai, M. Swaminathan
{"title":"用传输矩阵法对有延迟的配电网进行建模","authors":"T. Watanabe, K. Srinivasan, H. Asai, M. Swaminathan","doi":"10.1109/EPEP.2004.1407595","DOIUrl":null,"url":null,"abstract":"This work describes the analysis of multilayered power distribution networks that include signal lines and vias. The signal lines are modeled as transmission lines, and vias are represented as not only self and mutual inductances but also include retardation currents. The structures have been analyzed using the transmission matrix method (TMM) in the frequency domain. Analysis using the TMM provides considerable savings in memory compared to SPICE.","PeriodicalId":143349,"journal":{"name":"Electrical Performance of Electronic Packaging - 2004","volume":"67 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"Modeling of power distribution networks with retardation using the transmission matrix method\",\"authors\":\"T. Watanabe, K. Srinivasan, H. Asai, M. Swaminathan\",\"doi\":\"10.1109/EPEP.2004.1407595\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work describes the analysis of multilayered power distribution networks that include signal lines and vias. The signal lines are modeled as transmission lines, and vias are represented as not only self and mutual inductances but also include retardation currents. The structures have been analyzed using the transmission matrix method (TMM) in the frequency domain. Analysis using the TMM provides considerable savings in memory compared to SPICE.\",\"PeriodicalId\":143349,\"journal\":{\"name\":\"Electrical Performance of Electronic Packaging - 2004\",\"volume\":\"67 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electronic Packaging - 2004\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2004.1407595\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging - 2004","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2004.1407595","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modeling of power distribution networks with retardation using the transmission matrix method
This work describes the analysis of multilayered power distribution networks that include signal lines and vias. The signal lines are modeled as transmission lines, and vias are represented as not only self and mutual inductances but also include retardation currents. The structures have been analyzed using the transmission matrix method (TMM) in the frequency domain. Analysis using the TMM provides considerable savings in memory compared to SPICE.