用于电路仿真的RRAM热复位转换的SPICE建模

F. Jiménez-Molinos, G. González-Cordero, P. Cartujo-Cassinello, J. Roldán
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引用次数: 3

摘要

提出了一种基于物理的单极电阻性存储器SPICE紧凑模型。该模型包括考虑丝阻开关操作的欧姆和量子传导。此外,还详细描述了热效应。可以考虑不同类型的导电丝(CFs);特别是树枝状的细丝。在电路仿真工具中以模块化和全面的方式进行了实现。考虑电学和热力学内部变量的演变,对电压脉冲作用下的复位瞬态响应进行了仿真和深入分析。对随机存储器响应中的热惯性进行了分析和表征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SPICE modeling of RRAM thermal reset transitions for circuit simulation purposes
A physically based SPICE compact model for unipolar resistive memories is presented. The model includes ohmic and quantum conduction accounting for filamentary resistive switching operation. In addition, a detailed description of thermal effects is incorporated. Different types of conductive filaments (CFs) can be taken into consideration; in particular, tree-branch shaped filaments. The implementation in a circuit simulation tool has been performed in a modular and comprehensive manner. The reset transient response under voltage pulse operation is simulated and analyzed in depth taking into account the evolution of electric and thermal internal variables. The thermal inertia in the RRAM response has been considered and characterized.
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