嵌入式全耗尽SOI SRAM的设计

R. Sung, J. C. Koob, T. Brandon, D. Elliott, B. Cockburn
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引用次数: 3

摘要

我们描述了一种嵌入式128 kb绝缘体上硅(SOI) CMOS SRAM的设计,它与一系列间距匹配的处理元件集成在一起,在一个集成电路内提供大规模并行数据处理。试验采用0.25-/spl mu/m全耗尽SOI工艺。给出了SOI存储核心的设计和布局,并给出了标定电路的仿真结果。研究了浮动体效应对内存读和写的影响。描述了由浮体电压引起的感测放大器的阈值失配效应。将浮体效应与在0.25-/spl mu/m部分耗尽SOI工艺中设计的SRAM的模拟结果进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of an embedded fully-depleted SOI SRAM
We describe the design of an embedded 128-Kb Silicon-On-Insulator (SOI) CMOS SRAM, which is integrated alongside an array of pitch-matched processing elements to provide massively-parallel data processing within one integrated circuit. An experimental 0.25-/spl mu/m fully-depleted SOI process was used. The design and layout of the SOI memory core and results from calibrated circuit simulations are presented. The impact of the floating body effect is investigated for both memory reads and writes. We describe threshold mismatch effects in the sense amplifier that result from the floating body voltage. Floating body effects are compared against simulated results for an SRAM designed in a 0.25-/spl mu/m partially-depleted SOI process.
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