VMOS晶体管中寄生电容的最小化

I. S. Bhatti, T. Rodgers, J. Edwards
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引用次数: 3

摘要

减小VMOS晶体管寄生电容的工艺技术(1)已经得到了发展。为了实现高性能的VMOS工艺,栅极漏极重叠电容和结电容的侧壁分量显著降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Minimization of parasitic capacitances in VMOS transistors
Process techniques for the reduction of parasitic capacitances in VMOS transistors (1) have been developed. Significant reductions in gate to drain overlap capacitance and side wall component of the junction capacitance have been achieved for a high performance VMOS process.
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