用于高性能集成超级电容器的多孔硅电极

K. Grigoras, J. Keskinen, J. Ahopelto, M. Prunnila
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引用次数: 4

摘要

我们展示了可用于集成微型超级电容器的高性能多孔硅基超级电容器电极。这里的关键促成因素是多孔Si基体的超薄TiN涂层,从而实现高功率和稳定性。采用原子层沉积法(ALD)沉积TiN层,提供了足够的共度以到达高纵横比孔的底部。我们的多孔硅超级电容器器件具有几乎理想的双层电容器特性,电极体积电容为7.3 F/cm。与未涂覆的多孔硅电极相比,功率和能量密度增加了几个数量级。在超过5000次的充放电循环中,设备具有良好的稳定性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Porous silicon electrodes for high performance integrated supercapacitors
We demonstrate high performance porous Si based supercapacitor electrodes that can be utilized in integrated micro supercapacitors. The key enabler here is ultra-thin TiN coating of the porous Si matrix leading to high power and stability. The TiN layer is deposited by atomic layer deposition (ALD), which provides sufficient conformality to reach the bottom of the high aspect ratio pores. Our porous Si supercapacitor devices exhibit almost ideal double layer capacitor characteristic with electrode volumetric capacitance of 7.3 F/cm. Several orders of magnitude increase in power and energy density is obtained comparing to uncoated porous silicon electrodes. Good stability of devices is confirmed performing over 5 000 charge/discharge cycles.
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