厚膜和LTCC技术的非标准理化和电学检查

2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400) Pub Date : 2000-05-14 DOI:10.1109/ICMEL.2000.838740

A. Dziedzic

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引用次数: 4

摘要

本文的目的是介绍和讨论一些用于聚合物或陶瓷厚膜技术和低温共烧陶瓷(LTCC)技术所需的原料、油墨、薄膜和器件的理化和电学研究的非标准诊断方法。提出了制造商和用户的观点。除了对具体方法的描述外，还讨论了它们的结果和结论对改进厚膜器件制造和提高可靠性的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Non-standard physicochemical and electrical examinations in thick-film and LTCC technologies

The aim of this paper is to present and discuss some non-standard diagnostic methods used for physicochemical and electrical investigations of raw materials, inks, films and devices necessary for or fabricated by polymer or cermet thick-film technology as well as Low Temperature Cofired Ceramics (LTCC) one. Both manufacturer's and user's point of view are presented. Besides description of particular methods, their results and conclusions affected improvement of thick-film device fabrication and reliability increase is discussed.

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来源期刊

2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)

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