先进CMOS技术中基于缺陷的电路可靠性仿真紧凑模型

I. Esqueda, H. Barnaby
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引用次数: 9

摘要

提出了一种基于缺陷的基于表面电位计算的电路可靠性仿真紧凑建模方法。建模方法捕获了应力诱导缺陷的偏置依赖性,例如(大块)氧化捕获电荷和界面陷阱,这些缺陷无法通过典型的固定电压移位模型(即阈值电压,基于vth的模型)来描述。缺陷动态电荷贡献是在非平衡条件下和所有操作区域(即从弱到强反转)建模的,而不仅仅是在阈值处(如在基于vth的模型中)。通过二维TCAD仿真验证了模型的正确性,其中包含了氧化物捕获电荷和界面捕获密度。环形振荡器和SRAM电池的香料级模拟表明,与基于缺陷的紧凑建模方法相比,使用典型的固定电压漂移模型在描述老化效应方面存在不准确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Defect-based compact model for circuit reliability simulation in advanced CMOS technologies
A defect-based compact modeling approach for circuit reliability simulation based on surface potential calculations is presented. The modeling approach captures the bias-dependence of stress-induced defects such as (bulk) oxide-trapped charge and interface traps that cannot be described by typical fixed voltage shift models (i.e., threshold voltage, Vth-based models). The defect dynamic charge contribution is modeled under non-equilibrium conditions and for all regions of operation (i.e. from weak to strong inversion) and not just at the threshold (as in Vth-based models). The modeled is verified with 2-D TCAD simulations that incorporate oxide trapped charge and interface trap densities. Spice-level simulations of ring oscillators and SRAM cells reveal inaccuracies in describing aging effects when utilizing typical fixed voltage shift models as compared to the presented defect-based compact modeling approach.
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