半导体和MEMS外部机械应力的开放模型

2018 IEEE International Conference on Microelectronic Test Structures (ICMTS) Pub Date : 2018-03-01 DOI:10.1109/ICMTS.2018.8383795

R. Buhler, R. Giacomini

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引用次数: 0

摘要

本文定义了半导体和MEMS中外部机械应力表征所需的弯曲设备解决方案和校准的细节。该设备适用于在受控的外部机械应力条件下，在探针站进行器件的电气特性分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Open model for external mechanical stress of semiconductors and MEMS

This paper defines the details of the bending equipment solution and the calibration required for characterization of external mechanical stress in semiconductors and MEMS. The equipment is suited for use in probe station for electrical characterization of devices under controlled external mechanical stress.

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来源期刊

2018 IEEE International Conference on Microelectronic Test Structures (ICMTS)

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