FinFET与UTBB SOI - A射频透视

J. Raskin
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引用次数: 9

摘要

FinFET和超薄体和盒式(UTBB)绝缘体上硅(SOI) mosfet是满足国际半导体技术路线图(ITRS)要求的最有前途的先进器件。这两种装置近年来都得到了深入的研究。大多数报告的数据都与他们的数字表现有关。本文对它们的模拟/射频性能进行了描述和比较。两者在跨导、早期电压、电压增益、自热问题方面都表现出非常相似的特性,但由于其相对较低的边缘寄生电容,UTBB在截止频率方面优于FinFET。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
FinFET versus UTBB SOI — A RF perspective
FinFET and Ultra Thin Body and BOX (UTBB) Silicon-on-Insulator (SOI) MOSFETs are the most promising advanced devices to fulfill the International Technology Roadmap for Semiconductors (ITRS) requirements. Both devices have been intensively studied these last years. Most of the reported data concern their digital performance. In this paper, their analog/RF behavior is described and compared. Both show pretty similar characteristics in terms of transconductance, Early voltage, voltage gain, self-heating issue but UTBB outperforms FinFET in terms of cutoff frequencies thanks to their relatively lower fringing parasitic capacitances.
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