{"title":"结合FIB电路编辑和OBIRCH技术进行故障分析的研究","authors":"J. Yan, Xuesen Liu, Mike Liu, YiLing Liu","doi":"10.1109/IPFA.2009.5232588","DOIUrl":null,"url":null,"abstract":"This paper discusses combining Focused Ion Beam (FIB) circuit edit with OBIRH technology. FIB can cut or rewire an integrated circuit. OBIRCH can locate failure location. If FIB circuit edit & OBIRCH were applied at the same time, we can locate the failure site and find the root cause of the failure. The paper will share one case of failure analysis and present advanced FIB technology.","PeriodicalId":210619,"journal":{"name":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A study of combining FIB circuit edit and OBIRCH technology for failure analysis\",\"authors\":\"J. Yan, Xuesen Liu, Mike Liu, YiLing Liu\",\"doi\":\"10.1109/IPFA.2009.5232588\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses combining Focused Ion Beam (FIB) circuit edit with OBIRH technology. FIB can cut or rewire an integrated circuit. OBIRCH can locate failure location. If FIB circuit edit & OBIRCH were applied at the same time, we can locate the failure site and find the root cause of the failure. The paper will share one case of failure analysis and present advanced FIB technology.\",\"PeriodicalId\":210619,\"journal\":{\"name\":\"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2009.5232588\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2009.5232588","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A study of combining FIB circuit edit and OBIRCH technology for failure analysis
This paper discusses combining Focused Ion Beam (FIB) circuit edit with OBIRH technology. FIB can cut or rewire an integrated circuit. OBIRCH can locate failure location. If FIB circuit edit & OBIRCH were applied at the same time, we can locate the failure site and find the root cause of the failure. The paper will share one case of failure analysis and present advanced FIB technology.