基于平面和FinFET技术的6T SRAM单元性能分析

Aswathy A Kumar, Anu Chalil
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引用次数: 9

摘要

嵌入式SRAM单元因其更快的存储操作和更低的功耗而成为现代soc中不可或缺的一部分。随着CMOS器件的缩小,将会有很多后果,如短通道效应,这将影响器件的性能。FinFET技术是一种通过更好地控制通道上的栅极来克服短通道效应影响并提高6T静态随机存取存储器(SRAM)电路设计性能的技术。本研究的目的是模拟和评估平面和基于finfet的6T SRAM单元的性能,并比较它们的结果。本文观察SRAM性能考虑的因素有SNM、写裕量、读电流、漏电和待机漏电。通过静态噪声裕度分析,采用蝴蝶法确定了SRAM位单元的稳定性。在所有的分析和模拟中,Hspice都使用了16nm技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Performance Analysis of 6T SRAM Cell on Planar and FinFET Technology
Embedded SRAM cell have become an immanent part in modern SoCs because of the faster memory operation and lower power consumption.As CMOS devices scaling down, there will be a lot of consequences such as short channel effects which will affect the device performance. FinFET technology a technology to overcome the effects of short channel effects by giving better control for gate over the channel and to improve the performance of 6T Static Random Access Memory (SRAM) circuit design. The purpose of this study is to simulate and evaluate the performance of planar and FinFET-based 6T SRAM cell and compare their results. The factors considering in this paper to observe the performance of SRAM are SNM, write margin, read current, leakage and standby leakage.The stability of SRAM bit cell is determined by static noise margin analysis, by butterfly method. Here for all the analysis and simulations Hspice is used in 16nm technology.
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