制程变化下编码片上总线信令延迟变化分析

S. Tuuna, J. Isoaho, H. Tenhunen
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引用次数: 6

摘要

在这篇论文中,我们在一个由编码、驱动、传输线、接收器和解码组成的总线上模拟片上信号。我们将信号电路描述为其负载电容的函数。针对去耦方法和分布式RLC传输线模型,推导了驱动器看到的有效负载电容。利用推导出的有效电容对应的驱动器延迟和上升时间,推导出传输线母线远端电压。在信号电路的表征和电线分析中考虑了工艺变化的影响。然后计算由器件和导线工艺变化引起的总线总延迟变化。通过与HSPICE的比较验证了模型的正确性。我们实现了规则电压模式、电平编码双轨和l-of-4信号电路,并应用推导的模型对它们进行了分析。实现和分析是在45纳米技术下完成的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis of Delay Variation in Encoded On-Chip Bus Signaling under Process Variation
In this paper, we model on-chip signaling over a bus consisting of encoding, drivers, transmission lines, receivers and decoding. We characterize the signaling circuitry as a function of its load capacitance. The effective load capacitance seen by a driver is derived for the decoupling method and distributed RLC transmission line models. The driver delay and rise time corresponding to the derived effective capacitance are used to derive the far-end voltage of a transmission line bus. The effects of process variation are taken into account in the characterization of the signaling circuitry and in the wire analysis. The overall delay variation of the bus due to device and wire process variation is then calculated. The model is verified by comparing it to HSPICE. We implement regular voltage mode, level- encoded dual-rail and l-of-4 signaling circuitry and apply the derived model to analyze them. The implementation and analysis are done in 45 nm technology.
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