全球连接之路——无线通信进入下一代

J. Hausner
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引用次数: 0

摘要

随着移动宽带(MBB)技术的发展,设备需要支持不断增加的多频率带宽和急剧爆炸的数据速率。5G的新空中接口将再次显示数据速率的提高,就像我们从2G、3G、HSPA、LTE和LTE高级版本看到的那样。这些技术在单个设备中为所有人提供了最好的服务,无论他们身在何处。开发下一代利用更高密度的模拟和数字硅电路,以实现低成本高性能的解决方案。除了这些MBB系统,大规模可靠的机器类型通信——也被称为物联网——将在5G技术的保护下得到发展。本次演讲将详细阐述相关无线电和半导体技术面临的挑战,并重点介绍实现下一代全球连接解决方案的架构突破。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The path to global connectivity — Wireless communication enters the next generation
As mobile broadband (MBB) technologies evolve, devices need to support increasing bandwidth with multiple frequencies and dramatically exploding data rates. New air interfaces in 5G will show once again the gain in data rates as we have seen from 2G, to 3G to HSPA, to LTE and LTE advanced. These technologies in a single device provide the best possible services with great user experience to all people no matter where they are. Developing the next generation takes advantage of higher density in analog and digital silicon circuitry to enable low cost high performance solutions. Next to those MBB systems, massive and reliable machine-type communications — also known as the Internet of Things — will get developed under the umbrella of 5G technologies. This talk will elaborate on challenges of related radio and semiconductor technologies, and highlight architectural breakthroughs to enable next generation solutions for global connectivity.
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