一种新的裸片集成电路和smd的无华盛顿混合安装技术

Proceedings of Japan International Electronic Manufacturing Technology Symposium Pub Date : 1993-06-09 DOI:10.1109/IEMT.1993.639288

H. Ozaki

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引用次数: 0

摘要

随着表面贴装技术(SMT)的发展，半导体贴装技术变得越来越重要。我们开发了一种新的用于裸片ic和smd的混合安装技术，该技术不需要清洗过程。到目前为止，清洗工艺对于混合安装是必不可少的，因为裸片ic是在smd回流焊后安装的。通过改变smd和ic的安装顺序，以及开发一种新的金属屏掩膜，我们成功地消除了洗涤过程。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A New Washingless Hybrid-mounting Technique For Bare Chip ICs And SMDs

With the development of SMT(Surface Mount Technology), the semiconductor mounting technique is becoming more important than ever. We have debeloped a new hybrid-mounting technique for bare chip ICs and SMDs, which does not require a washing process. Until now washing process was essential for hybrid mounting because the bare chip ICs were mounted after reflow soldering of the SMDs. We have succeeded in eliminating the washing process by changing the order of mounting the SMDs and ICs ,and by developing a new metal screen mask.

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Proceedings of Japan International Electronic Manufacturing Technology Symposium

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