T. Shimizu, J. Korematu, M. Satou, H. Kondo, S. Iwata, K. Sawai, N. Okumura, K. Ishimi, Y. Nakamoto, M. Kumanoya, K. Dosaka, A. Yamazaki, Y. Ajioka, H. Tsubota, Y. Nunomura, T. Urabe, J. Hinata, K. Saitoh
{"title":"多媒体32b RISC微处理器,16mb DRAM","authors":"T. Shimizu, J. Korematu, M. Satou, H. Kondo, S. Iwata, K. Sawai, N. Okumura, K. Ishimi, Y. Nakamoto, M. Kumanoya, K. Dosaka, A. Yamazaki, Y. Ajioka, H. Tsubota, Y. Nunomura, T. Urabe, J. Hinata, K. Saitoh","doi":"10.1109/ISSCC.1996.488577","DOIUrl":null,"url":null,"abstract":"This 32 b microprocessor with on-chip 2 MB DRAM is for multimedia applications that require a low-power embedded microprocessor and large memory. Using a typical 0.45 /spl mu/m DRAM process, double-metal CMOS technology, this chip integrates 17 M transistors in 19.9/spl times/7.7 mm/sup 2/. It consists of a 32 b RISC CPU, a 32 b/spl times/16 b multiply accumulator (MAC), a 2 MB DRAM, a 2 kB cache, an external bus interface unit (BIU), and control units. The CPU, DRAM, cache and BIU are connected with a single 128 b internal bus. At 66 MHz, the bus transfers a 128 b data line between the CPU and the cache in one cycle, and between CPU and DRAM in 5 cycles. The external bus is 16 b wide and operates at 16.67 MHz.","PeriodicalId":162539,"journal":{"name":"1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"48","resultStr":"{\"title\":\"A multimedia 32 b RISC microprocessor with 16 Mb DRAM\",\"authors\":\"T. Shimizu, J. Korematu, M. Satou, H. Kondo, S. Iwata, K. Sawai, N. Okumura, K. Ishimi, Y. Nakamoto, M. Kumanoya, K. Dosaka, A. Yamazaki, Y. Ajioka, H. Tsubota, Y. Nunomura, T. Urabe, J. Hinata, K. Saitoh\",\"doi\":\"10.1109/ISSCC.1996.488577\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This 32 b microprocessor with on-chip 2 MB DRAM is for multimedia applications that require a low-power embedded microprocessor and large memory. Using a typical 0.45 /spl mu/m DRAM process, double-metal CMOS technology, this chip integrates 17 M transistors in 19.9/spl times/7.7 mm/sup 2/. It consists of a 32 b RISC CPU, a 32 b/spl times/16 b multiply accumulator (MAC), a 2 MB DRAM, a 2 kB cache, an external bus interface unit (BIU), and control units. The CPU, DRAM, cache and BIU are connected with a single 128 b internal bus. At 66 MHz, the bus transfers a 128 b data line between the CPU and the cache in one cycle, and between CPU and DRAM in 5 cycles. The external bus is 16 b wide and operates at 16.67 MHz.\",\"PeriodicalId\":162539,\"journal\":{\"name\":\"1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-02-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"48\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.1996.488577\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.1996.488577","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A multimedia 32 b RISC microprocessor with 16 Mb DRAM
This 32 b microprocessor with on-chip 2 MB DRAM is for multimedia applications that require a low-power embedded microprocessor and large memory. Using a typical 0.45 /spl mu/m DRAM process, double-metal CMOS technology, this chip integrates 17 M transistors in 19.9/spl times/7.7 mm/sup 2/. It consists of a 32 b RISC CPU, a 32 b/spl times/16 b multiply accumulator (MAC), a 2 MB DRAM, a 2 kB cache, an external bus interface unit (BIU), and control units. The CPU, DRAM, cache and BIU are connected with a single 128 b internal bus. At 66 MHz, the bus transfers a 128 b data line between the CPU and the cache in one cycle, and between CPU and DRAM in 5 cycles. The external bus is 16 b wide and operates at 16.67 MHz.