A novel routing algorithm for MCM substrate verification using single-ended probe

Multi-chip Module (MCM) technology has become an important means to package high performance systems. However, wide usage of MCM technology has been restricted by the cost of design, fabrication and testing. Since electrical testing can cost as high as 50% of the MCM cost in the near future, an efficient MCM substrate test scheme is needed to ensure system reliability and reduce test cost. Numerous techniques are being pursued in the industry for testing unpopulated MCM substrates. Recently, a novel technique for testing MCM substrate using single-ended probe has been developed. In this paper, we present a heuristic algorithm to reduce the single-ended probe travel time in MCM substrate testing. Using our new novel heuristic algorithm, the test cost is dramatically reduced.