高射频功率下s参数测量的去嵌入技术,与热成像相结合

B. Ivira, F. Ndagijimana, R. Fillit
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引用次数: 1

摘要

本文研究了一种在高射频功率下精确测定单端口器件反射系数的方法。针对功率放大器、功率环行器和探头的不匹配,提出了一种基于s矩阵的去嵌入理论。这个工作台是为射频组件的可靠性问题而设计的。给出了在新型体声波谐振器上的实验应用实例。这些元件现在被广泛用于制造无线通信系统中的射频滤波器。此外,具有高空间分辨率(2¿m/像素)的红外摄像机提供了探针和器件内部自热引起的温度及其对射频功率的依赖的补充信息。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
De-embedding technique for S-parameter measurements under high RF power, coupled to thermal imaging
This work deals with a method for determining accurately reflection coefficient of one-port devices submitted to high RF power. A de-embedding theory based on S-matrix is carried out for mismatches of the test setup components: power amplifier, power circulator and probe. This bench was designed for reliability issues of RF components. An example of bench application on the new bulk acoustic wave resonator is presented. Those components are now widely used to build RF-filters in wireless-telecommunication systems. Moreover, an infrared camera with high spatial resolution (2 ¿m/pixel) gives complementary information about the temperature induced by self-heating inside probe and device, and its dependence on the RF power.
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