K. Lee, C. Nagai, A. Nakamura, Hiroki Aizawa, J. Bea, M. Koyanagi, H. Hashiguchi, T. Fukushima, Tanaka Tanaka
{"title":"重新配置的多晶片上(mCoW)铜/氧化物混合键合技术，采用嵌入式氧化物、薄胶粘合剂和薄金属覆盖层，实现超高密度3D集成","authors":"K. Lee, C. Nagai, A. Nakamura, Hiroki Aizawa, J. Bea, M. Koyanagi, H. Hashiguchi, T. Fukushima, Tanaka Tanaka","doi":"10.1109/3DIC.2015.7334471","DOIUrl":null,"url":null,"abstract":"High yield reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology is proposed for ultra-high density 2.5D/3D integration applications. New mCoW hybrid bonding technology use shallow-recess oxide structure, electro-less plated capping layers, and thin glue adhesive layer below 1um to avoid the issues of current standard CoW bonding technology. Multi numbers of TEG die with 7mm × 23mm size are simultaneously aligned with high accuracy around 1um using chip self-assembly technology and thermal-compression bonded by in batch. In the TEG chip, totally 684,000 electrode daisy chain comprising of 3μm diameter/6um pitch tiny Cu electrodes are well intact joined by new reconfigured mCoW hybrid bonding technology.","PeriodicalId":253726,"journal":{"name":"2015 International 3D Systems Integration Conference (3DIC)","volume":"226 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers\",\"authors\":\"K. Lee, C. Nagai, A. Nakamura, Hiroki Aizawa, J. Bea, M. Koyanagi, H. Hashiguchi, T. Fukushima, Tanaka Tanaka\",\"doi\":\"10.1109/3DIC.2015.7334471\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"High yield reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology is proposed for ultra-high density 2.5D/3D integration applications. New mCoW hybrid bonding technology use shallow-recess oxide structure, electro-less plated capping layers, and thin glue adhesive layer below 1um to avoid the issues of current standard CoW bonding technology. Multi numbers of TEG die with 7mm × 23mm size are simultaneously aligned with high accuracy around 1um using chip self-assembly technology and thermal-compression bonded by in batch. In the TEG chip, totally 684,000 electrode daisy chain comprising of 3μm diameter/6um pitch tiny Cu electrodes are well intact joined by new reconfigured mCoW hybrid bonding technology.\",\"PeriodicalId\":253726,\"journal\":{\"name\":\"2015 International 3D Systems Integration Conference (3DIC)\",\"volume\":\"226 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-11-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 International 3D Systems Integration Conference (3DIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/3DIC.2015.7334471\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC.2015.7334471","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers
High yield reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology is proposed for ultra-high density 2.5D/3D integration applications. New mCoW hybrid bonding technology use shallow-recess oxide structure, electro-less plated capping layers, and thin glue adhesive layer below 1um to avoid the issues of current standard CoW bonding technology. Multi numbers of TEG die with 7mm × 23mm size are simultaneously aligned with high accuracy around 1um using chip self-assembly technology and thermal-compression bonded by in batch. In the TEG chip, totally 684,000 electrode daisy chain comprising of 3μm diameter/6um pitch tiny Cu electrodes are well intact joined by new reconfigured mCoW hybrid bonding technology.
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