热通量传感器的壳体研制

R. V. Lobach, O. V. Lobach, R. P. Dikareva
{"title":"热通量传感器的壳体研制","authors":"R. V. Lobach, O. V. Lobach, R. P. Dikareva","doi":"10.1109/SIBEDM.2007.4292928","DOIUrl":null,"url":null,"abstract":"The thermal phenomena influence course of the majority of physical processes, therefore the control of thermal parameters represents huge practical interest, and rapid development of modern techniques demands from all metrological means, including from thermal measurement devices, more and more high accuracy and reliability. In turn development of such directions as the micromechanics and the micro system technology opens new opportunities before developers of measuring devices. On the basis of semiconductor materials, using the given technologies, it is possible to create the tiny heat flux sensors possessing high sensitivity and the low cost price. On faculty of semiconductor devices and microelectronics the silicon chip of a heat flux sensor has been developed, and also together with the Novosibirsk test set of sensitive elements (chips) has been produced.","PeriodicalId":106151,"journal":{"name":"2007 8th Siberian Russian Workshop and Tutorial on Electron Devices and Materials","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-08-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The Case Development of a Heat Flux Sensor\",\"authors\":\"R. V. Lobach, O. V. Lobach, R. P. Dikareva\",\"doi\":\"10.1109/SIBEDM.2007.4292928\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The thermal phenomena influence course of the majority of physical processes, therefore the control of thermal parameters represents huge practical interest, and rapid development of modern techniques demands from all metrological means, including from thermal measurement devices, more and more high accuracy and reliability. In turn development of such directions as the micromechanics and the micro system technology opens new opportunities before developers of measuring devices. On the basis of semiconductor materials, using the given technologies, it is possible to create the tiny heat flux sensors possessing high sensitivity and the low cost price. On faculty of semiconductor devices and microelectronics the silicon chip of a heat flux sensor has been developed, and also together with the Novosibirsk test set of sensitive elements (chips) has been produced.\",\"PeriodicalId\":106151,\"journal\":{\"name\":\"2007 8th Siberian Russian Workshop and Tutorial on Electron Devices and Materials\",\"volume\":\"29 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-08-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 8th Siberian Russian Workshop and Tutorial on Electron Devices and Materials\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SIBEDM.2007.4292928\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 8th Siberian Russian Workshop and Tutorial on Electron Devices and Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIBEDM.2007.4292928","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

热现象影响着大多数物理过程的过程,因此热参数的控制具有巨大的现实意义,现代技术的迅速发展对包括热测量装置在内的各种计量手段提出了越来越高的精度和可靠性的要求。而微力学和微系统技术等方向的发展也为测量设备的开发人员提供了新的机遇。在半导体材料的基础上,利用现有的技术,可以制造出具有高灵敏度和低成本价格的微型热流通量传感器。在半导体器件和微电子系,研制了热流通量传感器的硅片,并与新西伯利亚灵敏元件(芯片)试验台一起生产。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Case Development of a Heat Flux Sensor
The thermal phenomena influence course of the majority of physical processes, therefore the control of thermal parameters represents huge practical interest, and rapid development of modern techniques demands from all metrological means, including from thermal measurement devices, more and more high accuracy and reliability. In turn development of such directions as the micromechanics and the micro system technology opens new opportunities before developers of measuring devices. On the basis of semiconductor materials, using the given technologies, it is possible to create the tiny heat flux sensors possessing high sensitivity and the low cost price. On faculty of semiconductor devices and microelectronics the silicon chip of a heat flux sensor has been developed, and also together with the Novosibirsk test set of sensitive elements (chips) has been produced.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信