高性能modfet的GaInP/GaInAs/GaAs结构。设计,生长程序,霍尔数据和器件特性

K. Bachem, W. Pletschen, M. Maier, J. Wiegert, K. Winkler, B. Pereiaslavets, L. Eastman, H. Tobler, J. Dickman, P. Narozny
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引用次数: 4

摘要

提出了一种用于MODFET器件的新型GaInP/GaInAs/GaAs层结构。该结构的新特点是组成调制的伪晶GaInP势垒,适合在GaInP/GaInAs/GaAs结构中实现破纪录的二维电子密度。单面掺杂密度可达3/spl倍/10/sup 12//cm/sup 2/以上,双面掺杂密度可达5/spl倍/10/sup 12//cm/sup 2/以上。此外,在这些薄缓冲层上生长的MODFET结构中,厚度为2.5 nm的缓冲层足以在电子密度为3/spl倍/10/sup 12//cm/sup 2/时实现超过6000 cm/sup 2//Vs (RT)的电子迁移率。在这种异质结构上制造的MODFET器件仅使用10 nm厚的缓冲器,其输出跨导和掐断特性与在MBE生长结构上制造的AlGaAs/GaInAs/GaAs MODFET器件竞争有利。700 mS/mm和ft的固有跨导以及100 GHz和180 GHz的fmax值显示了新型无铝结构的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
GaInP/GaInAs/GaAs structures for high performance MODFETs. Design, growth procedure, Hall data and device properties
A new type of GaInP/GaInAs/GaAs layer structure for MODFET devices has been developed. The novel feature of this structure is a compositionally modulated, pseudomorphic GaInP barrier which is suited to achieve record breaking two dimensional electron densities in GaInP/GaInAs/GaAs structures. Densities upwards of 3/spl times/10/sup 12//cm/sup 2/ with single-sided doping, and over 5/spl times/10/sup 12//cm/sup 2/ with double-sided doping have been obtained. Furthermore, it is demonstrated that buffer layers as thin as 2.5 nm are sufficient to achieve electron mobilities of more than 6000 cm/sup 2//Vs (RT) for electron densities of 3/spl times/10/sup 12//cm/sup 2/ in MODFET structures grown on top of these thin buffer layers. MODFET devices fabricated on this type of heterostructure using only 10 nm thick buffers have output transconductances and pinch off characteristics competing favourably with AlGaAs/GaInAs/GaAs MODFET devices fabricated on MBE grown structures. Intrinsic transconductances of 700 mS/mm and ft and fmax values of 100 and 180 GHz, respectively, demonstrate the potential of the new Al free structures.
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