基于ingan后屏障的AlGaN/GaN hemt

T. Palacios, A. Chakraborty, S. Keller, S. Denbaars, U. Mishra
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引用次数: 7

摘要

在这项工作中,我们在GaN通道下方使用超薄InGaN层来增加电子的限制。在这种新方法中,利用InGaN层中的极化感应电场来提高缓冲层中相对于通道的导带能量。利用这种技术,可以在不需要高带隙或p掺杂缓冲器的情况下形成双异质结晶体管。泊松-薛定谔模拟(Wu等人)证实了电子温度高达3000k时电子约束的增加
本文章由计算机程序翻译,如有差异,请以英文原文为准。
AlGaN/GaN HEMTs with an InGaN-based back-barrier
In this work, we use an ultra-thin InGaN layer below the GaN channel to increase the confinement of the electrons. In this novel approach, the polarization induced electric field in the InGaN layer is used to raise the conduction band energy in the buffer layer with respect to the channel. With this technique, a double-heterojunction transistor can be formed without the need of a high bandgap or p-doped buffer. Poisson-Schrodinger simulations (Wu, et.al.) have confirmed the increased electron confinement at electron temperatures as high as 3000 K
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