利用多芯片模块技术实现电力电子器件的小型化和封装

Proceedings of APEC 97 - Applied Power Electronics Conference Pub Date : 1997-02-23 DOI:10.1109/APEC.1997.581431

K. Burgers, K. Olejniczak, S. Ang, E. Porter

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摘要

本文介绍了一种基于多芯片模块(MCM)技术的高集成度、智能化、整体马力的三相感应电动机驱动器的设计与制造。这种固态控制器-被称为多芯片电源模块(MCPM)-使用已知的优质模具，以获得最小的占地面积，体积和质量，同时最大限度地提高效率，可靠性和可制造性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The use of multichip module technology for power electronics miniaturization and packaging

This paper describes the design and fabrication of a highly integrated, intelligent, integral horsepower, three-phase induction motor drive based on multichip module (MCM) technology. This solid-state controller-known as a multichip power module (MCPM)-uses known good die to obtain minimal footprint, volume, and mass, while maximizing efficiency, reliability, and manufacturability.

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Proceedings of APEC 97 - Applied Power Electronics Conference

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