{"title":"有机基板上倒装芯片的快流、快固化底填料的评价","authors":"K. Wun, G. Margaritis","doi":"10.1109/ECTC.1996.517441","DOIUrl":null,"url":null,"abstract":"Seven underfill formulations have been evaluated for fast-flow fast-cure and low-clearance flow application for flip chip assembly. The effects of different ingredients are discussed. At least one formulation is found to have superior flow rate under a 30-micron die than any known commercial underfill available so far.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"25","resultStr":"{\"title\":\"The evaluation of fast-flow, fast-cure underfills for flip chip on organic substrates\",\"authors\":\"K. Wun, G. Margaritis\",\"doi\":\"10.1109/ECTC.1996.517441\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Seven underfill formulations have been evaluated for fast-flow fast-cure and low-clearance flow application for flip chip assembly. The effects of different ingredients are discussed. At least one formulation is found to have superior flow rate under a 30-micron die than any known commercial underfill available so far.\",\"PeriodicalId\":143519,\"journal\":{\"name\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"25\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1996.517441\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 Proceedings 46th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1996.517441","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The evaluation of fast-flow, fast-cure underfills for flip chip on organic substrates
Seven underfill formulations have been evaluated for fast-flow fast-cure and low-clearance flow application for flip chip assembly. The effects of different ingredients are discussed. At least one formulation is found to have superior flow rate under a 30-micron die than any known commercial underfill available so far.
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