研究可编程微电子纳米结构的历时性

P. Pfeifer, Z. Plíva
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引用次数: 1

摘要

设计和制造先进集成电路的新技术允许在超高纳米尺度密度下实现复杂结构的更高集成度。快速增长的FPGA器件世界为过程缩放分析和新的研究机会创造了重要的平台,以防新的过程变化和退化效应。然而,实际的器件并不是理想的器件,而且存在内部纳米结构老化的问题。fpga的参数随时间或在电源电压或温度变化的情况下发生变化,可能会导致显著的延迟,并可能影响最终的设计质量和可靠性。这样的时间变化可能导致延迟故障,直至最终设备或设备故障或失败。特别是ASIC设备的世界被一次又一次地全面调查,每(大约)2年就会出现新的工艺。本文提出了一种不同寻常的老化测量、分析和测试单元的解决方案,该解决方案基于特别设计的环形振荡器和利用Xilinx fpga中的内部块ram (BRAM),从65纳米到40纳米技术节点中选择。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigating diachrony of programmable microelectronic nanostructures
New technologies of design and manufacturing of advanced integrated circuits allow higher integration of complex structures in ultra-high nano-scale densities. The rapidly growing world of FPGA devices creates important platform for analyses of process scaling and new study opportunities in case of new process variations and degradation effects. However the real devices are not the ideal ones and they are subjects of aging of the internal nanostructures. Changes in parameters of FPGAs in time, or under either power supply voltage or temperature variations, can result in significant delays and may affect the final design quality and dependability. Such timing variations may result in delay faults, up to the final device or equipment malfunction or failure. Especially the world of ASIC devices is comprehensively investigated again and again with the new processes coming every (approximately) 2 years. This paper presents an unusual solution of the aging measurement, analysis and test unit, based on especially designed ring oscillators and utilization of the internal block RAMs (BRAM) in Xilinx FPGAs, selected from 65 nm down to the 40 nm technology node.
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