超高压气相沉积法生长0.1 /spl mu/m外延Si沟道n - mosfet时外延Si/Si衬底界面氧的影响

T. Ohguro, N. Sugiyama, K. Imai, K. Usuda, M. Saito, T. Yoshitomi, M. Ono, H. Momose, H. Iwai
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引用次数: 11

摘要

本文首次通过实验证实了本质掺杂外延沟道mosfet的gm值比本体mosfet的gm值高。研究发现,在UHV-CVD外延生长前对晶片进行预热对于提高外延层的晶体质量,从而获得高的gm值至关重要。采用700/spl℃预热5分钟,在0.1 /spl mu/m外延沟道n-MOSFET上获得了630 mS/mm的高gm值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The influence of oxygen at epitaxial Si/Si substrate interface for 0.1 /spl mu/m epitaxial Si channel N-MOSFETs grown by UHV-CVD
Very high gm values of intrinsic doped epitaxial channel MOSFETs compared with those of bulk MOSFETs has been experimentally confirmed for the first time. It has been found that preheating of the wafer before the UHV-CVD epitaxial growth is critically important to improve the crystal quality of the epitaxial layer and thus to obtain the high gm values. By adopting 700/spl deg/C 5 minutes preheating, a very high gm value of 630 mS/mm was obtained for a 0.1 /spl mu/m epitaxial channel n-MOSFET.
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