{"title":"用于生成信号完整性和时序管理建议的宏模型","authors":"P. Franzon, S. Simovich, S. Mehrotra, M. Steer","doi":"10.1109/ECTC.1993.346796","DOIUrl":null,"url":null,"abstract":"The electrical design of packaging for high speed digital systems requires intensive efforts on the part of signal integrity engineers. We have produced a set of tools that assist these engineers in efficiently producing PCB and MCM designs that meet timing and other electrical needs. This paper describes the most important aspect of this solution, the internal 'macromodels' that accurately capture the relationships between electrical/timing design and the package physical design (or layout).<<ETX>>","PeriodicalId":281423,"journal":{"name":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Macromodels for generating signal integrity and timing management advice for package design\",\"authors\":\"P. Franzon, S. Simovich, S. Mehrotra, M. Steer\",\"doi\":\"10.1109/ECTC.1993.346796\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The electrical design of packaging for high speed digital systems requires intensive efforts on the part of signal integrity engineers. We have produced a set of tools that assist these engineers in efficiently producing PCB and MCM designs that meet timing and other electrical needs. This paper describes the most important aspect of this solution, the internal 'macromodels' that accurately capture the relationships between electrical/timing design and the package physical design (or layout).<<ETX>>\",\"PeriodicalId\":281423,\"journal\":{\"name\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1993.346796\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1993.346796","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Macromodels for generating signal integrity and timing management advice for package design
The electrical design of packaging for high speed digital systems requires intensive efforts on the part of signal integrity engineers. We have produced a set of tools that assist these engineers in efficiently producing PCB and MCM designs that meet timing and other electrical needs. This paper describes the most important aspect of this solution, the internal 'macromodels' that accurately capture the relationships between electrical/timing design and the package physical design (or layout).<>