片上系统的变化感知和自修复设计方法

Jangjoon Lee, Srikar Bhagavatula, K. Roy, B. Jung
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引用次数: 4

摘要

由于对工艺、供应和温度变化的高度敏感性,深度缩放技术正在失去吸引力。由于边缘性,模拟和混合信号电路未能利用这些技术的高速和低噪声特性,而泄漏电流和延迟的变化使数字设计极具挑战性。因此,越来越需要一种新的设计方法,能够在PVT变化下提供高产量和更高的可靠性。在几种制造后校准策略中,基于实时传感和内置反馈的自修复由于能够动态适应参数变化而引起了人们的极大兴趣。本文研究了当前内置的变化感知和自修复设计,并讨论了在深度CMOS技术中为片上系统(SoC)设计开发连贯的自修复方法的挑战和策略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Variation-aware and self-healing design methodology for a system-on-chip
Due to high sensitivity to process, supply, and temperature variations, deep scaled technologies are losing appeal. Analog and mixed-signal circuits have failed to exploit high speed and low noise properties of these technologies due to marginalities, whereas variations in leakage current and delay have made digital design extremely challenging. Consequently, there is an increasing need for a new design methodology that can provide high yield and improved reliability under PVT variations. Among several post-fabrication calibration strategies, self-healing, which is based on real-time sensing and built-in feedback, has generated great interest because of the ability to dynamically adapt to parametric variations. This paper examines current built-in variation-aware and ad-hoc self-healing designs, and discusses the challenges and strategies in developing a coherent self-healing methodology for system-on-chip (SoC) design in deep-scaled CMOS technologies.
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