采用信号通孔的3D IC冷却机制

2013 IEEE XXXIII International Scientific Conference Electronics and Nanotechnology (ELNANO) Pub Date : 2013-04-16 DOI:10.1109/ELNANO.2013.6552044

A. Gevorgyan

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引用次数: 1

摘要

本文讨论了基于热导孔插入的三维集成电路(IC)的高效热能去除问题，并利用现有的信号导孔。这种方法可以最大限度地减少额外的热过孔的数量，从而节省芯片的有用面积。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3D IC cooling mechanism by using signaling vias

In this paper is discussed the problem of efficient thermal energy removal in 3D integrated circuits (IC) based on thermal via insertion in parallel with using existing signaling vias. This method allows to minimize the number of additional thermal vias and by this save useful area of chip.

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来源期刊

2013 IEEE XXXIII International Scientific Conference Electronics and Nanotechnology (ELNANO)

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