涂层应力在MCM大面积加工中的意义

Kwanho Yang, J. Im, R. Heistand
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引用次数: 13

摘要

采用有限元方法对大面积加工(LAP)中的基体弯曲进行了数值模拟。所考虑的结构是各种厚度的铝(Al)和玻璃基板,以及光敏膜厚度的涂层。研究发现,即使曲率可能很小,且线性弹性状态下的应力-应变行为,也不一定能从线性小挠度理论中得到大面积基底(例如400mm平方)的挠度。在这种情况下,必须采用非线性大挠度理论。此外,重力对基材重量的影响是非常显著的,也必须考虑在内。考虑这两个因素的模拟结果与在Al基板上旋转镀膜和固化BCB配方400/spl次/400/spl次/1.27 mm的实验数据吻合较好。作为使曲率变平的一种方法,模拟了在基材下施加真空。通过仅施加很小的真空,观察到基材偏转的显著减少。这一结果表明,使用双粘胶带在基材的底部,例如,也可能是可行的,以完全消除弓。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Significance of coating stress on substrate bow in large area processing of MCM
The substrate bow in a large area processing (LAP) was simulated using a finite element analysis (FEA). The structures considered were aluminum (Al) and glass substrates of various thicknesses, and a coating from photosensitive film thickness. It was found that the deflection of a large area substrate, e.g. 400 mm square, could not always be obtained from the linear, small deflection theory even if the curvature might be small and the stress-strain behavior in the linear elastic regime. In this case, the nonlinear, large deflection theory had to be adopted. Also, the gravity effect on the weight of substrate turned out to be very significant and had to be incorporated as well. The simulation incorporating these two factors agreed well with the experimental data, which was generated by spin coating and curing the BCB formulation on Al substrates, 400/spl times/400/spl times/1.27 mm. As a means of flattening out the curvature, subjecting a vacuum underneath the substrate was simulated. Significant reduction of the substrate deflection was observed by applying only a very small vacuum. This result suggested that the use of double-stick tape on the bottom of the substrate, for example, might also be feasible to completely eliminate the bow.
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