{"title":"太赫兹探测和成像系统及其应用","authors":"E. Grossman, J. Cheron","doi":"10.1109/CSICS.2016.7751068","DOIUrl":null,"url":null,"abstract":"We describe packaging challenges for the development of practical THz imagers based on InP transistor circuits. Very high aspect ratio (>20:1) die singulation and additive manufacturing for waveguide housings are shown to help in addressing these challenges.","PeriodicalId":183218,"journal":{"name":"2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Terahertz Detection and Imaging Systems and Applications\",\"authors\":\"E. Grossman, J. Cheron\",\"doi\":\"10.1109/CSICS.2016.7751068\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We describe packaging challenges for the development of practical THz imagers based on InP transistor circuits. Very high aspect ratio (>20:1) die singulation and additive manufacturing for waveguide housings are shown to help in addressing these challenges.\",\"PeriodicalId\":183218,\"journal\":{\"name\":\"2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSICS.2016.7751068\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2016.7751068","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Terahertz Detection and Imaging Systems and Applications
We describe packaging challenges for the development of practical THz imagers based on InP transistor circuits. Very high aspect ratio (>20:1) die singulation and additive manufacturing for waveguide housings are shown to help in addressing these challenges.
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