{"title":"咨询委员会主席的话","authors":"Tadao Nakamura","doi":"10.1109/CoolChips.2016.7503664","DOIUrl":null,"url":null,"abstract":"On behalf of the advisory committee of COOL Chips 20, I extend greetings to each of the conference attendees. This year we celebrate the 20th anniversary of this conference series that is part of the premier conference series on microprocessor architecture and technology and software. Today we have issues in cloud computing, cyber security, IoT, Big Data, and artificial intelligence, especially deep learning developed with very high performance processors, Big Data and corresponding algorisms.","PeriodicalId":439955,"journal":{"name":"2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Message from the advisory committee chair\",\"authors\":\"Tadao Nakamura\",\"doi\":\"10.1109/CoolChips.2016.7503664\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"On behalf of the advisory committee of COOL Chips 20, I extend greetings to each of the conference attendees. This year we celebrate the 20th anniversary of this conference series that is part of the premier conference series on microprocessor architecture and technology and software. Today we have issues in cloud computing, cyber security, IoT, Big Data, and artificial intelligence, especially deep learning developed with very high performance processors, Big Data and corresponding algorisms.\",\"PeriodicalId\":439955,\"journal\":{\"name\":\"2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)\",\"volume\":\"55 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CoolChips.2016.7503664\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CoolChips.2016.7503664","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
On behalf of the advisory committee of COOL Chips 20, I extend greetings to each of the conference attendees. This year we celebrate the 20th anniversary of this conference series that is part of the premier conference series on microprocessor architecture and technology and software. Today we have issues in cloud computing, cyber security, IoT, Big Data, and artificial intelligence, especially deep learning developed with very high performance processors, Big Data and corresponding algorisms.
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