减少全氟化合物排放[气相沉积室清洗]

IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168) Pub Date : 1998-09-23 DOI:10.1109/ASMC.1998.731554

C. Hines, J. N. Pinto, R.C. Izor, T. A. Tamayo, W. J. Miller

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引用次数: 1

摘要

六氟烷(C/sub 2/F/sub 6/)是一种全氟化合物(PFC)，在整个半导体工业中广泛用于清洁化学气相沉积(CVD)室。尽管根据美国环境保护署(EPA)目前的排放指南，对C/sub 2/F/sub 6/ clean的持续工艺改进有助于减少IBM微电子部门200毫米制造商在佛蒙特州埃塞克斯Junction的PFC排放，但还需要进一步减少。替代化学评价表明，使用经氦(He)稀释的三氟化氮(NF/sub - 3/)有可能显著减少PFC的排放。

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Reducing perfluorinated compound emissions [CVD chamber cleaning]

Hexafluorethane (C/sub 2/F/sub 6/) is a perfluorinated compound (PFC) used extensively throughout the semiconductor industry to clean chemical vapor deposition (CVD) chambers. Although ongoing process improvements to the C/sub 2/F/sub 6/ clean are helping to reduce PFC emissions at the IBM Microelectronics Division 200 mm fabricator in Essex Junction, Vermont, based on the current US Environmental Protection Agency (EPA) emission guidelines, further reduction is needed. Alternative chemistry evaluations indicate that the use of nitrogen trifluoride (NF/sub 3/) diluted in helium (He) has the potential to significantly reduce PFC emissions.

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IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168)

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