C. Jan, F. Al-amoody, H. Chang, T. Chang, Y. Chen, N. Dias, W. Hafez, D. Ingerly, M. Jang, E. Karl, S. Shi, K. Komeyli, H. Kilambi, A. Kumar, K. Byon, C. Lee, J. Lee, T. Leo, P. Liu, N. Nidhi, R. Olac-vaw, C. Petersburg, K. Phoa, C. Prasad, C. Quincy, R. Ramaswamy, T. Rana, L. Rockford, A. Subramaniam, C. Tsai, P. Vandervoorn, L. Yang, A. Zainuddin, P. Bai
{"title":"14纳米SoC平台技术,采用第二代三栅极晶体管、70纳米栅极间距、52纳米金属间距和0.0499 um2 SRAM单元,针对低功耗、高性能和高密度SoC产品进行了优化","authors":"C. Jan, F. Al-amoody, H. Chang, T. Chang, Y. Chen, N. Dias, W. Hafez, D. Ingerly, M. Jang, E. Karl, S. Shi, K. Komeyli, H. Kilambi, A. Kumar, K. Byon, C. Lee, J. Lee, T. Leo, P. Liu, N. Nidhi, R. Olac-vaw, C. Petersburg, K. Phoa, C. Prasad, C. Quincy, R. Ramaswamy, T. Rana, L. Rockford, A. Subramaniam, C. Tsai, P. Vandervoorn, L. Yang, A. Zainuddin, P. Bai","doi":"10.1109/vlsit.2015.7223683","DOIUrl":null,"url":null,"abstract":"A leading edge 14 nm SoC platform technology based upon the 2nd generation Tri-Gate transistor technology [5] has been optimized for density, low power and wide dynamic range. 70 nm gate pitch, 52 nm metal pitch and 0.0499 um2 HDC SRAM cells are the most aggressive design rules reported for 14/16 nm node SoC process to achieve Moore's Law 2x density scaling over 22 nm node. High performance NMOS/PMOS drive currents of 1.3/1.2 mA/um, respectively, have been achieved at 0.7 V and 100 nA/um off-state leakage, 37%/50% improvement over 22 nm node. Ultra-low power NMOS/PMOS drives are 0.50/0.32 mA/um at 0.7 V and 15pA/um Ioff. This technology also deploys high voltage I/O transistors to support up to 3.3 V I/O. A full suite of analog, mixed-signal and RF features are also supported.","PeriodicalId":181654,"journal":{"name":"2015 Symposium on VLSI Technology (VLSI Technology)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A 14 nm SoC platform technology featuring 2nd generation Tri-Gate transistors, 70 nm gate pitch, 52 nm metal pitch, and 0.0499 um2 SRAM cells, optimized for low power, high performance and high density SoC products\",\"authors\":\"C. Jan, F. Al-amoody, H. Chang, T. Chang, Y. Chen, N. Dias, W. Hafez, D. Ingerly, M. Jang, E. Karl, S. Shi, K. Komeyli, H. Kilambi, A. Kumar, K. Byon, C. Lee, J. Lee, T. Leo, P. Liu, N. Nidhi, R. Olac-vaw, C. Petersburg, K. Phoa, C. Prasad, C. Quincy, R. Ramaswamy, T. Rana, L. Rockford, A. Subramaniam, C. Tsai, P. Vandervoorn, L. Yang, A. Zainuddin, P. Bai\",\"doi\":\"10.1109/vlsit.2015.7223683\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A leading edge 14 nm SoC platform technology based upon the 2nd generation Tri-Gate transistor technology [5] has been optimized for density, low power and wide dynamic range. 70 nm gate pitch, 52 nm metal pitch and 0.0499 um2 HDC SRAM cells are the most aggressive design rules reported for 14/16 nm node SoC process to achieve Moore's Law 2x density scaling over 22 nm node. High performance NMOS/PMOS drive currents of 1.3/1.2 mA/um, respectively, have been achieved at 0.7 V and 100 nA/um off-state leakage, 37%/50% improvement over 22 nm node. Ultra-low power NMOS/PMOS drives are 0.50/0.32 mA/um at 0.7 V and 15pA/um Ioff. This technology also deploys high voltage I/O transistors to support up to 3.3 V I/O. A full suite of analog, mixed-signal and RF features are also supported.\",\"PeriodicalId\":181654,\"journal\":{\"name\":\"2015 Symposium on VLSI Technology (VLSI Technology)\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 Symposium on VLSI Technology (VLSI Technology)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/vlsit.2015.7223683\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 Symposium on VLSI Technology (VLSI Technology)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/vlsit.2015.7223683","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 14 nm SoC platform technology featuring 2nd generation Tri-Gate transistors, 70 nm gate pitch, 52 nm metal pitch, and 0.0499 um2 SRAM cells, optimized for low power, high performance and high density SoC products
A leading edge 14 nm SoC platform technology based upon the 2nd generation Tri-Gate transistor technology [5] has been optimized for density, low power and wide dynamic range. 70 nm gate pitch, 52 nm metal pitch and 0.0499 um2 HDC SRAM cells are the most aggressive design rules reported for 14/16 nm node SoC process to achieve Moore's Law 2x density scaling over 22 nm node. High performance NMOS/PMOS drive currents of 1.3/1.2 mA/um, respectively, have been achieved at 0.7 V and 100 nA/um off-state leakage, 37%/50% improvement over 22 nm node. Ultra-low power NMOS/PMOS drives are 0.50/0.32 mA/um at 0.7 V and 15pA/um Ioff. This technology also deploys high voltage I/O transistors to support up to 3.3 V I/O. A full suite of analog, mixed-signal and RF features are also supported.