nLDMOS晶体管热载流子退化的物理建模

Y. Wimmer, S. Tyaginov, F. Rudolf, K. Rupp, M. Bina, H. Enichlmair, J.M. Park, R. Minixhofer, H. Ceric, T. Grasser
{"title":"nLDMOS晶体管热载流子退化的物理建模","authors":"Y. Wimmer, S. Tyaginov, F. Rudolf, K. Rupp, M. Bina, H. Enichlmair, J.M. Park, R. Minixhofer, H. Ceric, T. Grasser","doi":"10.1109/IIRW.2014.7049511","DOIUrl":null,"url":null,"abstract":"Our physics-based HCD model has been validated using scaled CMOS transistors in our previous work. In this work we apply this model for the first time to a high-voltage nLDMOS device. For the calculation of the degrading behaviour the Boltzmann transport equation solver ViennaSHE is used which also requires high quality adaptive meshing. We discuss the influence of the different model components in the different device regions. Finally we compare the model to experimental degradation results and show that each one gives a significant contribution to the result and that all of them are needed in order to satisfactorily fit the experimental data.","PeriodicalId":260079,"journal":{"name":"2014 IEEE International Integrated Reliability Workshop Final Report (IIRW)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Physical modeling of hot-carrier degradation in nLDMOS transistors\",\"authors\":\"Y. Wimmer, S. Tyaginov, F. Rudolf, K. Rupp, M. Bina, H. Enichlmair, J.M. Park, R. Minixhofer, H. Ceric, T. Grasser\",\"doi\":\"10.1109/IIRW.2014.7049511\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Our physics-based HCD model has been validated using scaled CMOS transistors in our previous work. In this work we apply this model for the first time to a high-voltage nLDMOS device. For the calculation of the degrading behaviour the Boltzmann transport equation solver ViennaSHE is used which also requires high quality adaptive meshing. We discuss the influence of the different model components in the different device regions. Finally we compare the model to experimental degradation results and show that each one gives a significant contribution to the result and that all of them are needed in order to satisfactorily fit the experimental data.\",\"PeriodicalId\":260079,\"journal\":{\"name\":\"2014 IEEE International Integrated Reliability Workshop Final Report (IIRW)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE International Integrated Reliability Workshop Final Report (IIRW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IIRW.2014.7049511\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE International Integrated Reliability Workshop Final Report (IIRW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IIRW.2014.7049511","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

我们基于物理的HCD模型已经在我们之前的工作中使用缩放CMOS晶体管进行了验证。在这项工作中,我们首次将该模型应用于高压nLDMOS器件。对于退化行为的计算,使用玻尔兹曼输运方程求解器ViennaSHE,这也需要高质量的自适应网格划分。我们讨论了不同的模型组件在不同的设备区域的影响。最后,我们将模型与实验退化结果进行了比较,表明每一个都对结果有重要的贡献,并且为了满意地拟合实验数据,所有这些都是必需的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Physical modeling of hot-carrier degradation in nLDMOS transistors
Our physics-based HCD model has been validated using scaled CMOS transistors in our previous work. In this work we apply this model for the first time to a high-voltage nLDMOS device. For the calculation of the degrading behaviour the Boltzmann transport equation solver ViennaSHE is used which also requires high quality adaptive meshing. We discuss the influence of the different model components in the different device regions. Finally we compare the model to experimental degradation results and show that each one gives a significant contribution to the result and that all of them are needed in order to satisfactorily fit the experimental data.
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