{"title":"采用有限元模拟和纳米压痕方法研究无铅焊点的力学行为","authors":"Lifeng Wang, Jia Zhou, Yingjie Liu, Q. Ge, Yuanjian Zhang, Wenqin Dai","doi":"10.1109/ICEPT.2015.7236582","DOIUrl":null,"url":null,"abstract":"Nanoindentation experiment together with the finite element simulation was used to study the mechanical behavior of Sn3.0Ag0.5Cu (SAC305) lead-free solder joint under cyclic loading-unloading. The effect of different maximum loads and holding time on the micromechanics behavior was investigated. The results indicated that the increase of the maximum load caused the increase of the depth of residual indentation and the area of hysteresis loop. The creep displacement of solder joint was increased with the prolonging of holding time. It increased sharply at first, and then went stabilized. In addition, a good agreement between finite element model and experimental results was reached.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The finite element simulation and nanoindentation methods for the study of mechanical behavior of lead-free solder joints\",\"authors\":\"Lifeng Wang, Jia Zhou, Yingjie Liu, Q. Ge, Yuanjian Zhang, Wenqin Dai\",\"doi\":\"10.1109/ICEPT.2015.7236582\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nanoindentation experiment together with the finite element simulation was used to study the mechanical behavior of Sn3.0Ag0.5Cu (SAC305) lead-free solder joint under cyclic loading-unloading. The effect of different maximum loads and holding time on the micromechanics behavior was investigated. The results indicated that the increase of the maximum load caused the increase of the depth of residual indentation and the area of hysteresis loop. The creep displacement of solder joint was increased with the prolonging of holding time. It increased sharply at first, and then went stabilized. In addition, a good agreement between finite element model and experimental results was reached.\",\"PeriodicalId\":415934,\"journal\":{\"name\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"50 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-09-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2015.7236582\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2015.7236582","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The finite element simulation and nanoindentation methods for the study of mechanical behavior of lead-free solder joints
Nanoindentation experiment together with the finite element simulation was used to study the mechanical behavior of Sn3.0Ag0.5Cu (SAC305) lead-free solder joint under cyclic loading-unloading. The effect of different maximum loads and holding time on the micromechanics behavior was investigated. The results indicated that the increase of the maximum load caused the increase of the depth of residual indentation and the area of hysteresis loop. The creep displacement of solder joint was increased with the prolonging of holding time. It increased sharply at first, and then went stabilized. In addition, a good agreement between finite element model and experimental results was reached.
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